Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference27 articles.
1. Low profile plastic quad flat package: LPPQFP
2. Molded carrier rings for fine pitch surface mount packages
3. Solder Joint Reliability
4. Dynamic characterization of surface-mount component leads for solder joint inspection
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Finite element analysis and simulation of adhesive bonding, soldering and brazing: A bibliography (1976 - 1996);Modelling and Simulation in Materials Science and Engineering;1997-03-01
2. Package-to-Board Interconnections;Microelectronics Packaging Handbook;1997
3. Finite element and boudary element methods in probabilistic engineering mechanics — A bibliography (1992–1994);Finite Elements in Analysis and Design;1994-11
4. Reliability Aspects of Fine Pitch Assembly;Handbook of Fine Pitch Surface Mount Technology;1994
5. A Brief Introduction to Fine Pitch Surface Mount Technology;Handbook of Fine Pitch Surface Mount Technology;1994
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