1. Freiberger, R., “Fine Pitch Processing,” Proc. Technical Program, Surface Mount Technology Association Surface Mount Exposition and Conference, Boston, MA, 1990, p. 696.
2. Hutchins, C. L., “Current Trends in Reflow Soldering Equipment,” Electronic Packaging and Production, May 1991, p. 173.
3. Economou, M., “Extra Fine Pitch Rework,” Proc. Nepcon West, 1992, p. 1474.
4. Hudson, E. T., “Ultra Fine Pitch SMD Automated Assembly,” Proc. 5th International SAMPE Conference, 1991, p. 153.
5. Marcoux, P., “Fine-Pitch Manufacturing,” Circuits Assembly, May 1991, p. 34.