Total Quality Management (TQM) and Statistical Process Control (SPC) for Fine Pitch Assembly-Reference-Cited by-同舟云学术

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Total Quality Management (TQM) and Statistical Process Control (SPC) for Fine Pitch Assembly

Published:1994 Issue: Volume: Page:520-549
ISSN:
Container-title:Handbook of Fine Pitch Surface Mount Technology
language:
Short-container-title:

Author:

Lancaster Michael

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4684-1437-0_18.pdf

Reference13 articles.

1. ANSI/IPC-S-815B (1987) American National Standards Institute and Interconnecting and Packaging Electronic Circuits, Lincolnwood, IIIinois.

2. Lancaster, M. G., “Six Sigma in Contract Manufacturing,” Pr oc. Surface Mount International August 1991; J. SMT, 5(2), April 1992.

3. Bhote, K. R., World Class Quality, AMA Membership Publications, New York, 1988, p. 52.

4. Keller, J., Joe Keller Associates, Plantation, Florida.

5. Connell, M., “Using Localized Electromigration Testing to Determine PCBA Cleanliness,” Pr oc. Surface Mount International, August 1992.

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