Author:
Moser Z.,Fima P.,Bukat K.,Sitek J.,Pstruś J.,Gąsior W.,Kościelski M.,Gancarz T.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. Evaluation of Lead- Free Solder Joints in Electronic Assemblies
2. Impact of Drop-In Lead Free Solders on Microelectronics Packaging
3. Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions
4. Gąsior, W., Moser, Z. and Pstruś, J. (2004a), “Measurements of the surface tension and density of tin based Sn‐Ag‐Cu‐Sb liquid alloys”,Arch. Metall. Mater., Vol. 49 No. 1, pp. 155‐67.
5. Gąsior, W., Moser, Z., Pstruś, J., Bukat, K., Kisiel, R. and Sitek, J. (2004b), “(Sn‐Ag)eut + Cu soldering materials. Part I: wettability studies”,J. Phase Equilib. Diff., Vol. 25 No. 2, pp. 115‐21.
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