Predicting Fatigue Initiation Life of Sn/3.8Ag/0.7Cu Solder using Endochronic Cyclic Damage-Coupled Viscoplastic Theory

Abstract

AbstractThis paper studied cyclic behavior Sn/3.8Ag/0.7Cu solder with dendritic microstructure. A cyclic damage factor D under constant strain amplitude fatigue tests, was defined by using the reducing rate of maximum cyclic tensile stress σa. The critical cyclic damage DC and it's fatigue initiation life NI were determined very consistently by using separately the experimental σavs. N curves and the percolation theory. The endochronic cyclic damage-coupled viscoplastic theory proposed by the 1st author was used to simulate cyclic stress-strain hysteresis loops with damage under strain amplitude (εa) 0.8% at 298K. The results were in very good agreement with data. Combining the evolution equation of intrinsic damage and the computed cyclic stress-inelastic strain relation, a modified Coffin-Manson relationship was derived. By setting DC = 0.3, it predicted very effectively the NI data under σa from 0.2% to 1.0%.