Isothermal Fatigue Damage Model for Lead-free Solder-Reference-Cited by-同舟云学术

Isothermal Fatigue Damage Model for Lead-free Solder

Published:2006-04 Issue:2 Volume:15 Page:109-119
ISSN:1056-7895
Container-title:International Journal of Damage Mechanics
language:en
Short-container-title:International Journal of Damage Mechanics

Author:

Wei Yong¹,Chow C. L.²,Vianco Paul³,Fang Eliot³

Affiliation:

1. Ford Motor Company, Box 214, ATNPC, 35500 Plymouth Road, Livonia, MI 48150, USA,

2. Department of Mechanical Engineering, University of Michigan-Dearborn Dearborn, MI 48128, USA

3. Sandia National Laboratories, PO Box 5800, MS 0820, Albuquerque NM 87185-0820, USA

Abstract

This article presents an investigation of lead-free solder material 95.5Sn-3.9Ag-0.6Cu under isothermal fatigue loading. The effects of strain rate on hysteresis loop and fatigue life over the total strain range from 0.4 to 1% at room temperature are investigated. A fatigue damage model is established to characterize the isothermal fatigue behavior of the material with the theory of damage mechanics. A fatigue failure criterion is proposed based on the concept of damage accumulation in solder material. The model takes into account the effect of strain rate in the development of constitutive and damage evolution equations. The life prediction is compared with the testing data and has shown a good agreement.

Publisher

SAGE Publications

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,Computational Mechanics

Link

http://journals.sagepub.com/doi/pdf/10.1177/1056789506060732

Reference12 articles.

1. Isothermal Fatigue of 63Sn-37Pb Solder

2. Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*

3. Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

4. Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn–3.5Ag

5. A nonlinear kinematic hardening theory for cyclic thermoplasticity and thermoviscoplasticity

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