Author:
Aluru K.,Wen F.-L.,Shen Y.-L.
Abstract
ABSTRACTA numerical study is undertaken to simulate failure of solder joint caused by cyclic shear deformation. A progressive ductile damage model is incorporated into the rate-dependent elastic-viscoplastic finite element analysis, resulting in the capability of simulating damage evolution and eventual failure through crack formation. It is demonstrated that quantitative information of fatigue life, as well as the temporal and spatial evolution of fatigue cracks, can be explicitly obtained.
Publisher
Oxford University Press (OUP)
Subject
Applied Mathematics,Mechanical Engineering,Condensed Matter Physics
Reference21 articles.
1. Externally constrained plastic flow in miniaturized metallic structures: A continuum-based approach to thin films, lines, and joints
2. Solders in electronics
3. 21. Shen Y.-L. and Aluru K , “Numerical Study of Ductile Failure Morphology in Solder Joints under Fast Loading Conditions,” Microelectronics Reliability, in press.
4. The Exponential Law of Endurance Tests;Basquin;Proceedings of the American Society for Testing and Materials,1910
5. The Endochronic Viscoplasticity for Sn/3.9Ag/0.6Cu Solder Under Low Strain Rate Fatigue Loading Coupled with Thermal Cycling
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献