Lap shear test for solder materials: Local stress states and their effect on deformation and damage-Reference-Cited by-同舟云学术

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Lap shear test for solder materials: Local stress states and their effect on deformation and damage

Published:2020-06 Issue: Volume:109 Page:113655
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Siroky Georg,Magnien Julien,Melinc David,Kozeschnik Ernst,Kieslinger Dietmar,Kraker Elke,Ecker Werner

Funder

Bundesministerium für Verkehr, Innovation und Technologie

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

1. Effect of material, geometry, surface treatment and environment on the shear strength of single lap joints;da Silva;Int. J. Adhes. Adhes.,2009

2. Improved theoretical solutions for adhesive lap joints;Tsai;Int. J. Solids Struct.,1998

3. The effects of geometry and material properties on the fracture of single lap-shear joints;Kafkalidis;Int. J. Solids Struct.,2002

4. Effect of adhesive type and thickness on the lap shear strength;da Silva;J. Adhes.,2006

5. Direct simulation of fatigue failure in solder joints during cyclic shear;Aluru;Mater. Des.,2011

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