Author:
Aluru K.,Wen F.-L.,Shen Y.-L.
Subject
Applied Mathematics,General Mathematics
Reference29 articles.
1. Solders in electronics;Plumbridge;J Mater Sci,1996
2. Solder joint fatigue models: review and applicability to chip scale packages;Lee;Microelectron Reliab,2000
3. Critical aspects of high-performance microprocessor packaging;Atluri;MRS Bull,2003
4. Basquin OH. The exponential law of endurance tests. In: Proceedings of the american society for testing and materials, vol. 10; 1910. p. 625–30.
5. A study of the effects of cyclic thermal stresses on a ductile metal;Coffin;Trans ASME,1954
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