Author:
Chong Leong Gan,Uda Hashim
Publisher
Public Library of Science (PLoS)
Reference25 articles.
1. Harman GG (1999) Wirebonding in Microelectronic: Materials, Processes, Reliability, and Yield, 2nd ed. New York: McGraw Hill.
2. Chauhan P, Zhong ZW, Pecht M (2013) Copper Wire Bonding Concerns and Best Practices. J. Electron. Mater. doi:10.1007/s11664-013-2576-1
3. Gan CL, Ng EK, Chan BL, Hashim U (2012) Reliability Challenges of Cu Wire Deployment in Flash Memory Packaging, IEEE IMPACT 2012, Taipei, 18–21.
4. Gan CL, Toong TT, Lim CP, Ng CY (2010) Environmental friendly Package Development by using Copper Wire bonding, In Proceedings of 34th IEEE CPMT IEMT, Malacca, 2010, 1–5.
5. Zeng Y, Bai K, Jin H (2013) Thermodynamic study on the corrosion mechanism of copper wire bonding. Microelectron. Reliab. doi:10.1016/j.microrel.2013.03.006
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献