Author:
Zeng Yingzhi,Bai Kewu,Jin Hongmei
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference49 articles.
1. Wire bonding in microelectronics materials, processes, reliability and yield;Harman,1997
2. Khoury SL, Burkhard DJ, Galloway DP, Scharr TA. In: 40th Electronic components and technology conference, vol. 1. Las Vegas, NV, USA; 1990. p. 768–76.
3. Corrosion reliability of electronic systems;Ambat;ECS Trans,2008
4. Breach CD, Tee WM, Lee TK, Holliday R. Moisture induced corrosion in gold and copper ball bonds. In: Electronic manufacturing technology symposium (IEMT). 2010 34th IEEE/CPMT international; 2010. p. 1–11.
5. Moisture-induced delamination in plastic encapsulated microelectronic devices: a physics of failure approach;Alpern;IEEE Trans Dev Mater Reliab,2008
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