Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)
Author:
Kumar P. Manoj1, Gergely G.1, Horváth D. K.1, Gácsi Z.1
Affiliation:
1. Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology , University of Miskolc , Hungary
Abstract
Abstract
The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.
Publisher
Walter de Gruyter GmbH
Subject
Metals and Alloys,Mechanics of Materials
Reference15 articles.
1. [1] El-Daly, AA., El-Hosainy, H., Elmosalami, TA., Desoky, WM.: Journal of Alloys and Compounds, 2015, p. 402 2. [2] El-Daly, AA., Al-Ganainy, GS., Fawzy, A., Younis, MJ.: Materials & Design, vol. 55, 2014, p. 837 3. [3] El-Daly, AA., Fawzy, A., Mansour, SF., Younis, MJ.: Materials Science and Engineering A, vol. 578, 2013, p. 62 4. [4] Nai, SML., Wei, J., Gupta, M.: Thin Solid Films, vol. 504, 2006, no. 1-2, p. 401 5. [5] Liu, P., Yao, P., Liu, J.: Journal of Electronic Materials, vol. 37, 2008, no. 6, p. 874
Cited by
22 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
|
|