Modeling and Fabrication Aspects of Cu- and Carbon Nanotube-Based Through-Silicon Vias-Reference-Cited by-同舟云学术

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Modeling and Fabrication Aspects of Cu- and Carbon Nanotube-Based Through-Silicon Vias

Published:2018-12-23 Issue:3 Volume:67 Page:377-393
ISSN:0377-2063
Container-title:IETE Journal of Research
language:en
Short-container-title:IETE Journal of Research

Author:

Goyal Tanu¹,Majumder Manoj Kumar²,Kaushik Brajesh Kumar³^ORCID

Affiliation:

1. Department of Electronics and Communication Engineering, IEC CET, Greater Noida, India

2. Department of Electronics and Communication Engineering, International Institute of Information Technology, Naya Raipur, India

3. Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee 247667, India

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Computer Science Applications,Theoretical Computer Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/03772063.2018.1553638

Reference30 articles.

1. International Technology Roadmap for Semiconductors, 2011 [online]. http://public.itrs.net.

2. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

3. High-Speed Design and Broadband Modeling of Through-Strata-Vias (TSVs) in 3D Integration

4. 3D Stacked Package Technology and Its Application Prospects

5. The interpretation and application of Rent's rule

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1. Design of Silicon Core Coaxial TSVs to Reduce Crosstalk Effects for 3D IC Applications;IETE Journal of Research;2024-08-06

2. Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint;Microelectronic Engineering;2024-07

3. New Advances in Antenna Design toward Wearable Devices Based on Nanomaterials;Biosensors;2024-01-10

4. Novel Circuit Model of Multi-walled CNT Bundle Interconnects Using Multi-valued Ternary Logic;IETE Journal of Research;2020-12-30

5. Role of Through Silicon Via in 3D Integration: Impact on Delay and Power;Journal of Circuits, Systems and Computers;2020-09-04

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