Novel Circuit Model of Multi-walled CNT Bundle Interconnects Using Multi-valued Ternary Logic-Reference-Cited by-同舟云学术

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Novel Circuit Model of Multi-walled CNT Bundle Interconnects Using Multi-valued Ternary Logic

Published:2020-12-30 Issue: Volume: Page:1-13
ISSN:0377-2063
Container-title:IETE Journal of Research
language:en
Short-container-title:IETE Journal of Research

Author:

Sulochana V.¹,Venkataiah C.²,Agrawal Sunil³,Singh Balwinder¹^ORCID

Affiliation:

1. ACS Division, Centre for Development of Advanced Computing, Mohali 160071, India

2. Rajeev Gandhi Memorial College of Engineering & Technolgy, Nandyal, Andhra Pradesh, India

3. Department of ECE, University Institute of Engineering & Technology, Panjab University, Chandigarh 160071, India

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Computer Science Applications,Theoretical Computer Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/03772063.2020.1864235

Reference26 articles.

1. Process-Induced Delay Variation in SWCNT, MWCNT, and Mixed CNT Interconnects

2. Modeling and Fabrication Aspects of Cu- and Carbon Nanotube-Based Through-Silicon Vias

3. Ballistic Transport in Metallic Nanotubes with Reliable Pd Ohmic Contacts

4. How do carbon nanotubes fit into the semiconductor roadmap?

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design implementations of ternary logic systems: A critical review;Results in Engineering;2024-09

2. Optimal segmentation of Cu–CNT interconnects;Multiscale and Multidisciplinary Modeling, Experiments and Design;2024-04-10

3. Performance Analysis of Nano Transistor Based Binary and Ternary Logic Gates;INT J INTEGR ENG;2024

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