Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics with a Hot Spot-Reference-Cited by-同舟云学术

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Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics with a Hot Spot

Published:2016-09-29 Issue:14-15 Volume:38 Page:1235-1246
ISSN:0145-7632
Container-title:Heat Transfer Engineering
language:en
Short-container-title:Heat Transfer Engineering

Author:

Reddy Sohail R.,Abdoli Abas,Dulikravich George S.,Pacheco Cesar C.,Vasquez Genesis,Jha Rajesh,Colaco Marcelo J.,Orlande Helcio R. B.

Publisher

Informa UK Limited

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/01457632.2016.1242953

Reference18 articles.

1. Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

2. Optimized multi-floor throughflow micro heat exchangers

3. Computational Modeling of Hot-Spot Identification and Control in 3-D Stacked Chips with Integrated Cooling

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1. Validation of Continuous Conjugate Heat Transfer Model through Experimental Data;Heat Transfer Engineering;2024-05-22

2. Multi‐objective optimization of a Fibonacci phyllotaxis micro pin‐fin heat sink;Heat Transfer;2024-05-21

3. Thermal Performance Evaluation of Micro Pin–Fin Heat Exchangers: Part I—Geometrical Design Parameters Optimization;International Journal of Precision Engineering and Manufacturing;2023-10-30

4. Multi-Objective Optimization of Air-Cooled Perforated Micro-Pin Fin Heat Sink Via an Artificial Neural Network Surrogate Model Coupled With NSGA-II;Journal of Thermal Science and Engineering Applications;2023-10-20

5. Thermal performance index based characterization and experimental validation for heat dissipation by unconventional arrayed micro pin-fins;Thermal Science and Engineering Progress;2023-08

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