Optimized multi-floor throughflow micro heat exchangers
Author:
Publisher
Elsevier BV
Subject
General Engineering,Condensed Matter Physics
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1. Liquid Cooling for High‐Heat‐Flux Electronic Devices;Thermal Management for Opto‐electronics Packaging and Applications;2024-05-31
2. Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics with a Hot Spot;Heat Transfer Engineering;2016-09-29
3. Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots;Journal of Electronic Packaging;2015-09-01
4. Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot;International Journal of Thermal Sciences;2015-04
5. Multi-objective Design Optimization of Branching, Multifloor, Counterflow Microheat Exchangers;Journal of Heat Transfer;2014-07-15
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