Computational Modeling of Hot-Spot Identification and Control in 3-D Stacked Chips with Integrated Cooling-Reference-Cited by-同舟云学术

Computational Modeling of Hot-Spot Identification and Control in 3-D Stacked Chips with Integrated Cooling

Published:2013-10-29 Issue:3 Volume:65 Page:201-215
ISSN:1040-7782
Container-title:Numerical Heat Transfer, Part A: Applications
language:en
Short-container-title:Numerical Heat Transfer, Part A: Applications

Author:

Alfieri Fabio,Gianini Sacha,Tiwari Manish K.,Brunschwiler Thomas,Michel Bruno,Poulikakos Dimos

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,Numerical Analysis

Link

http://www.tandfonline.com/doi/pdf/10.1080/10920277.2013.826480

Reference36 articles.

1. Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2. Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

3. High-performance heat sinking for VLSI

4. A closed-loop electronics cooling by implementing single phase impinging jet and mini channels heat exchanger

5. T. Brunschwiler , H. Rothuizen , M. Fabbri , U. Kloter , B. Michel , R. J. Bezama , and G. Natarajan , Direct Liquid Jet-Impingement Cooling with Micron-Sized Nozzle Array And Distributed Return Architecture, inProc. 10th Intersoc. Conf. Thermal Thermomechanical Phenomena Electronics Systems, Las Vegas, NV, pp. 196–203, 2006.

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improved thermal network modeling of die stacking DRAM and optimization;Integration;2022-07

2. Numerical study on hotspots adaptive cooling and thermal-hydraulic performance enhancement of fractal microchannel heat sink embedded with hydrogels;International Journal of Thermal Sciences;2022-02

3. Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling;IEEE Access;2020

4. Experimental Investigation on Heat Spreader Integrated Microchannel Using Graphene Oxide Nanofluid;Heat Transfer Engineering;2019-08-12

5. Single- and Multiphase Flow for Electronic Cooling;Handbook of Thermal Science and Engineering;2018