Single- and Multiphase Flow for Electronic Cooling
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-26695-4_49
Reference130 articles.
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3. Alfieri F, Tiwari MK, Zinovik I, Poulikakos D, Brunschwiler T, Michel B (2010) 3D integrated water cooling of a composite multilayer stack of chips. J Heat Transf 132(12):121402. https://doi.org/10.1115/1.4002287
4. Alfieri F, Gianini S, Tiwari MK, Brunschwiler T, Michel B, Poulikakos D (2013) Computational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling. Numer Heat Transf A Appl 65(3):201–215. https://doi.org/10.1080/10920277.2013.826480
5. Ansys [Fluent], release 17.0, Help System (2016), Modeling Multiphase Flows, Ansys, Inc. http://www.ansys.com/products/academic/citations
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