A molecular dynamics investigation of the micro-mechanism for vacancy formation between Ag3Sn and βSn under electromigration
Author:
Affiliation:
1. College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, China
2. Institute of Process Equipment and Control, Zhejiang University, Hangzhou, China
Funder
National Nature Science Foundation of China
Publisher
Informa UK Limited
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Molecular Biology,Biophysics
Link
https://www.tandfonline.com/doi/pdf/10.1080/00268976.2017.1367855
Reference39 articles.
1. Mass Transport of Aluminum by Momentum Exchange with Conducting Electrons
2. Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation
3. 3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package
4. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
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