Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference31 articles.
1. Recent prospectives and challenges of 3D heterogeneous integration. E-prime-Advances in electrical engineering;Zhang;Electro Energy,2022
2. A review of 5G front-end systems package integration;Watanabe;IEEE Trans Compon Packag Manuf Technol,2020
3. Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints;Wang;Solder Surf Mt Technol,2021
4. Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure;Chada;J Electron Mater,2000
5. Cu-Cu joining using citrate coated ultra-small nano-silver pastes;Zhang;J Manuf Process,2021
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1. Joining mechanism, microstructure, and mechanical properties of AZ31/6061 joint prepared by pouring fusion welding process assisted with Zn-xSn brazing filler;Journal of Adhesion Science and Technology;2023-09-06
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