Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference31 articles.
1. Recent prospectives and challenges of 3D heterogeneous integration. E-prime-Advances in electrical engineering;Zhang;Electro Energy,2022
2. A review of 5G front-end systems package integration;Watanabe;IEEE Trans Compon Packag Manuf Technol,2020
3. Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints;Wang;Solder Surf Mt Technol,2021
4. Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure;Chada;J Electron Mater,2000
5. Cu-Cu joining using citrate coated ultra-small nano-silver pastes;Zhang;J Manuf Process,2021
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques;Materials Characterization;2024-09
2. Effects of neutron irradiation on failure behavior analysis of high-density bumps under thermo-coupling conditions;Materials Science in Semiconductor Processing;2024-07
3. Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method;Microelectronics Reliability;2024-05
4. Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing;Journal of Materials Research and Technology;2024-03
5. Joining mechanism, microstructure, and mechanical properties of AZ31/6061 joint prepared by pouring fusion welding process assisted with Zn-xSn brazing filler;Journal of Adhesion Science and Technology;2023-09-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3