Role of the deposition parameters in the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique-Reference-Cited by-同舟云学术

Role of the deposition parameters in the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique

Published:1997-09 Issue:3 Volume:76 Page:259-272
ISSN:1364-2812
Container-title:Philosophical Magazine B
language:en
Short-container-title:Philosophical Magazine B

Author:

Martins R.¹,Maçarico A.¹,Ferreira I.¹,Fidalgo J.¹,Fortunato E.¹

Affiliation:

1. a Faculdade de Ciencias e Tecnologia , Universidade Nova de Lisboa and Centre of Excellence for Microelectronic and Optoelectronic Processes, Institute for the Development of New Technologies , Quinta da Torre, P-2825 , Monte de Caparica , Portugal

Publisher

Informa UK Limited

Subject

General Physics and Astronomy,General Chemical Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/01418639708241091

Reference32 articles.

1. Plasma processes under vacuum conditions

2. Particle agglomeration study in rf silane plasmas:Insitustudy by polarization‐sensitive laser light scattering

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