Author:
Yu Po-Huai,Wu Kun-Ling,Lee Shin-Min,Yan Biing-Hwa
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference21 articles.
1. Study of electrical discharge machining technology for slicing silicon ingots
2. Cutting of polished single-crystal silicon by wire electrical discharge machining
3. Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining
4. High efficiency slicing of low resistance silicon ingot by wire electrolytic-spark hybrid machining
5. Takahashi , H. ; Okamoto , Y. ; Uno , Y. ; Okada , A. ; Abe , Y. ; Takata , S. Investigation on multi-wire EDM slicing method for polycrystalline silicon ingot . In3rd International Conference of Asian Society for Precision Engineering and Nanotechnology, Kitakyushu , Japan , November 11–13 , 2009 .
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献