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High efficiency slicing of low resistance silicon ingot by wire electrolytic-spark hybrid machining

  • Published:2009-04 Issue:7 Volume:209 Page:3149-3155
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Wang W.,Liu Z.D.,Tian Z.J.,Huang Y.H.,Liu Z.X.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference10 articles.

1. The impact of semiconductors on the concepts of electrochemistry;Gerischer;Electrochim. Acta,1990

2. Research on the functional requirement about cooling liquid of WEDM-HS;Liu;Avi. Prec. Manuf. Technol.,2006

3. Investigation of silicon wafering by wire EDM;Luo;J. Mater. Sci.,1992

4. Mitsubishi Electric, 2007. http://global.mitsubishielectric.com/company/corp/mgmt/rd/.

5. Nikkei, B.P., 2007. http://techon.nikkeibp.co.jp/english/NEWS_EN/20070720/136476/.

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