Funder
Australian Research Council
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference176 articles.
1. No exponential is forever: but" forever" can be delayed![semiconductor industry],2003
2. Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw;Wang;Mater Sci Semicond Process,2017
3. Grinding technology: theory and application of machining with abrasives;Malkin,2008
4. Progress of research in slicing technology of large-scale silicon wafers,2008
5. Free abrasive machining in slicing brittle materials with wiresaw;Yang;J Electron Packag,2001
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献