Study of electrical discharge machining technology for slicing silicon ingots
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference5 articles.
1. Stress analysis of a silicon-wafer slicer cutting the crystal ingot;Chonan;J. Mech. Des.,1993
2. Vibration and defection of a silicon-wafer slicer cutting the crystal ingot;Chonan;J. Vibr. Acoust.,1993
3. Modeling stresses of contacts in wire saw slicing of polycrystalline and crystalline ingots: application to silicon wafer production;Li;J. Electron. Packaging,1998
4. Development of a resinoid diamond wire containing metal powder for slicing a slicing ingot;Shimazaki;Ann. CIRP,1999
5. Investigation of silicon wafering by wire EDM;Luo;J. Mater. Sci.,1992
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