Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Slicing Ingot-Reference-Cited by-同舟云学术

Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Slicing Ingot

Published:1999 Issue:1 Volume:48 Page:273-276
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Enomoto Toshiyuki,Shimazaki Yutaka,Tani Yasuhiro,Suzuki Mari,Kanda Yuichi

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference6 articles.

1. Abrasive Machining of Silicon;Tönshoff;Annals of the CIRP,1990

2. ID-Cut-off Grinding of Brittle Materials;Brinksmeier;Annals of the CIRP,1987

3. Precision Sawing with Wire Saw;Fujisawa;Annals of the CIRP,1983

4. Study on Machining Characteristics of Wire Tool with Electrodeposited Diamond Grains;Ishikawa;Journal of JSME,1994

5. Ogawa, H., Yamanaka, M., Urakawa, N., Miyake, M., Hara, A., 1997, Cutting Performance of Bonded Abrasives Type Diamond Wire Saw, Proceedings of Conference of JSGE: 369-370.

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Efficient manufacture of high-performance electroplated diamond wires utilizing Cr-coated diamond micro-powder;Materials Science in Semiconductor Processing;2024-08

2. Research on N-type silicon crystal processing by liquid-immersion wire electrical discharge machining;Materials Science and Engineering: B;2024-07

3. Crystalline Silicon Ingot Pulling and Wafering Technology;Photovoltaic Solar Energy;2024-06-21

4. Dislocations in Crystalline Silicon Solar Cells;Advanced Energy and Sustainability Research;2023-12-27

5. Research on N-Type Silicon Crystal Processing by Liquid-Immersion Wire Electrical Discharge Machining;2023