ID-Cut-off Grinding of Brittle Materials-Reference-Cited by-同舟云学术

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ID-Cut-off Grinding of Brittle Materials

Published:1987 Issue:1 Volume:36 Page:219-222
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Brinksmeier E.,Von Schmieden W.,Trumpold H.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference6 articles.

1. Semiconductor silicon-production and diamond machining;Janus;Industrial Diamond Review,1979

2. ID sawing-diameters increase;Büttner;Industrial Diamond Review.,1985

3. Slizing and grinding semiconductor materials;Brandt;Industrial Diamond Review,1985

4. Innenlochsägen, Geometrie und Kinematik des Werkzeugeingriffs;Meis;Industrie-Anzeiger,1985

5. Nondestructive testing for evaluating surface integrity;Brinksmeier;Ann. of CIRP,1984

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Silicon Wafers; Its Manufacturing Processes and Finishing Techniques: an Overview;Silicon;2022-05-20

2. A normal force model for ultrasonic vibration-assisted inner-diameter slicing of hard and brittle materials;Journal of Manufacturing Processes;2021-12

3. Ductile Mode Cutting of Silicon;Springer Series in Advanced Manufacturing;2019-10-13

4. Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining;Journal of Manufacturing Science and Engineering;2018-06-04

5. Sonderverfahren;Fertigungsverfahren 2;2017-04-28

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