Ductile Mode Cutting of Silicon
Author:
Publisher
Springer Singapore
Link
http://link.springer.com/content/pdf/10.1007/978-981-32-9836-1_6
Reference27 articles.
1. Pei ZJ, Billingsley SR, Miura S (1999) Grinding induced subsurface cracks in silicon wafers. Int J Mach Tools Manufact 39:1103–1116
2. Zarudi I, Zhang L (1996) Subsurface damage in single-crystal silicon due to grinding and polishing. J Mater Sci Lett 15:586–587
3. Brinksmeier E, von Schmieden W (1987) ID-cut-off grinding of brittle materials. CIRP Ann 36:219–222
4. Enomoto T, Shimazaki Y, Tani Y et al (1999) Development of a resinoid diamond wire containing metal powder for slicing a slicing ingot. CIRP Ann 48:273–276
5. Yan J, Yoshino M, Kuriagawa T et al (2001) On the ductile machining of silicon for micro electro-mechanical system (MEMS), opto-electronic and optical applications. Mater Sci Eng A 297:230–234
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