Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH
Author:
Affiliation:
1. School of Mechanical Engineering, Universiti Teknologi Malaysia, Johor Bahru, Malaysia
Funder
Ministry of Higher Education, Malaysia
Universiti Teknologi Malaysia
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/2374068X.2020.1754741
Reference28 articles.
1. Through silicon via: From the CMOS imager sensor wafer level package to the 3D integration
2. Beyond Moore's Law: the interconnect era
3. A method to alleviate hot spot problem in 3D IC
4. Revisiting 3DIC benefit with multiple tiers
5. A deadlock-free routing algorithm for irregular 3D network-on-chips with wireless links
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