A method to alleviate hot spot problem in 3D IC-Reference-Cited by-同舟云学术

A method to alleviate hot spot problem in 3D IC

Published:2018-04 Issue: Volume:190 Page:19-27
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Hou Ligang,Ye Tongyang,Luo Qiming,Fu Jingyan,Wang Jinhui

Funder

Beijing Municipal Natural Science Foundation

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Signal integrity aware TSV positioning;Hou;Electromagnetic Compatibility,2012

2. A novel thermal-aware structure of TSV cluster in 3D IC;Hou;Microelectron. Eng.,2016

3. Physical design for 3D system on package;Lim;IEEE Des. Test Comput.,2005

4. Placement and routing in 3D integrated circuits;Ababei;IEEE Des. Test Comput.,2005

5. An analytical placement framework for 3-D ICs and its extension on thermal awareness;Luo;IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.,2013

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