Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader-Reference-Cited by-同舟云学术

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Maximizing the thermal hotspot reduction by optimizing the thickness of multilayer hBN heat spreader

Published:2023-05 Issue: Volume:158 Page:107356
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Bulya Nazim Nur Julia Nazim,Abdullah Mohd Faizol,Mat Hussin Mohd Rofei,Mohamad Badaruddin Siti Aishah,Hashim Abdul Manaf

Funder

Malaysia Japan International Institute of Technology, Universiti Teknologi Malaysia

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference52 articles.

1. Direct band-gap crossover in epitaxial monolayer boron nitride;Elias;Nat. Commun.,2019

2. Hexagonal boron nitride is an indirect bandgap semiconductor;Cassabois;Nat. Photonics,2016

3. Electron tunneling through ultrathin boron nitride crystalline barriers;Britnell;Nano Lett.,2012

4. Hexagonal boron nitride tunnel barriers grown on graphite by high temperature molecular beam epitaxy;Cho;Sci. Rep.,2016

5. Fowler-Nordheim tunneling characteristics of graphene/hBN/metal heterojunctions;Iqbal;J. Appl. Phys.,2019

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation;Journal of Electronic Materials;2024-07-08

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