Type-II band alignment for atomic layer deposited HfSiO4 on α-Ga2O3

Author:

Xia Xinyi1ORCID,Li Jian-Sian1ORCID,Wen Zhuoqun2ORCID,Khan Kamruzzaman2ORCID,Khan Md Irfan3ORCID,Ahmadi Elaheh3ORCID,Oshima Yuichi4ORCID,Hays David C.5ORCID,Ren Fan1ORCID,Pearton S. J.6ORCID

Affiliation:

1. Department of Chemical Engineering, University of Florida 1 , Gainesville, Florida 32611

2. Department of Materials Science and Engineering, University of Michigan 2 , Ann Arbor, Michigan 48109

3. Department of Electrical Engineering and Computer Science, University of Michigan 3 , Ann Arbor, Michigan 48109

4. Optical Single Crystals Group, National Institute for Materials Science 4 , 1-1 Namiki, 305-0044 Tsukuba, Japan

5. Nanoscale Research Facility, University of Florida 5 , Gainesville, Florida 32611

6. Department of Materials Science and Engineering, University of Florida 6 , Gainesville, Florida 32611

Abstract

There is increasing interest in α-polytype Ga2O3 for power device applications, but there are few published reports on dielectrics for this material. Finding a dielectric with large band offsets for both valence and conduction bands is especially challenging given its large bandgap of 5.1 eV. One option is HfSiO4 deposited by atomic layer deposition (ALD), which provides conformal, low damage deposition and has a bandgap of 7 eV. The valence band offset of the HfSiO4/Ga2O3 heterointerface was measured using x-ray photoelectron spectroscopy. The single-crystal α-Ga2O3 was grown by halide vapor phase epitaxy on sapphire substrates. The valence band offset was 0.82 ± 0.20 eV (staggered gap, type-II alignment) for ALD HfSiO4 on α-Ga0.2O3. The corresponding conduction band offset was −2.72 ± 0.45 eV, providing no barrier to electrons moving into Ga2O3.

Funder

Defense Threat Reduction Agency

National Science Foundation

Air Force Office of Scientific Research

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

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