Heterogeneous Integration of PoP-Reference-Cited by-同舟云学术

Heterogeneous Integration of PoP

Published:2019 Issue: Volume: Page:205-219
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Container-title:Heterogeneous Integrations
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Author:

Lau John H.

Publisher

Springer Singapore

Link

http://link.springer.com/content/pdf/10.1007/978-981-13-7224-7_7

Reference23 articles.

1. Dreiza, M., A. Yoshida, K. Ishibashi, and T. Maeda, “High Density PoP (Package-on-Package) and Package Stacking Development”, IEEE/ECTC Proceedings, May 2007, pp. 1397–1402.

2. Carson, F., and S. Lee, “Controlling Top Package Warpage for POP Applications”, IEEE/ECTC Proceedings, May 2007, pp. 737–742.

3. Vijayaragavan, N., F. Carson, and A. Mistry, “Package on Package Warpage—Impact on Surface Mount Yields and Board Level Reliability”, IEEE/ECTC Proceedings, May 2008, pp. 389–386.

4. Lee, M., Yoo, M., Cho, J., Lee, S., Kim, J., Lee, C., Kang, D., Zwenger, C., and Lanzone, R., “Study of Interconnection Process for Fine Pitch Flip Chip”, IEEE/ECTC Proceedings, May 25–28, 2009, pp. 720–723.

5. Eslampour, H., S. Lee, S. Park, T. Lee, I. Yoon, and Y. Kim, “Comparison of Advanced PoP Package Configurations”, IEEE/ECTC Proceedings, May 2010, pp. 1946–1950.

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