High Density PoP (Package-on-Package) and Package Stacking Development-Reference-Cited by-同舟云学术

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High Density PoP (Package-on-Package) and Package Stacking Development

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 Proceedings 57th Electronic Components and Technology Conference
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Author:

Dreiza Moody,Yoshida Akito,Ishibashi Kazuo,Maeda Tadashi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4249837/4249838/04250063.pdf?arnumber=4250063

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Survey of Reliability Research on 3D Packaged Memory;Electronics;2023-06-17

2. Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Towards Copper-Copper Direct Bonding: Controlled Crystal Growth of Copper Deposits for Minimization of Interface Formation During Bonding;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

4. Processing and Reliability of Solder Interconnections in Stacked Packaging;3D Microelectronic Packaging;2020-11-24

5. Design of Multiobjective Optimal Laser Ablation Parameters of Hole Opening in Package-on-package Process;Sensors and Materials;2020-10-30

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