Author:
Suga Tadatomo,He Ran,Vakanas George,La Manna Antonio
Reference86 articles.
1. A. Fan, A. Rahman, R. Reif, Copper wafer bonding. Electrochem. Solid-State Lett. 2, 534–536 (1999). https://doi.org/10.1149/1.1390894
2. A. Shigetou, N. Hosoda, T. Itoh, T. Suga, Room-temperature direct bonding of CMP-Cu film for bumpless interconnection, in 2001 51st Electron Electronic Components and Technology Conference (Orlando, FL, 2001), pp 755–760
3. P.R. Morrow, C.-M. Park, S. Ramanathan, M.J. Kobrinsky, M. Harmes, Three-dimensional wafer stacking via Cu–Cu bonding integrated with 65-nm strained-Si/low-k CMOS technology. IEEE Electron Device Lett. 27, 335–337 (2006). https://doi.org/10.1109/LED.2006.873424
4. A. Shigetou, T. Itoh, M. Matsuo, N. Hayasaka, K. Okumura, T. Suga, Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) method. IEEE Trans. Adv. Packag. 29, 218–226 (2006). https://doi.org/10.1109/TADVP.2006.873138
5. B. Swinnen, W. Ruythooren, P. De Moor, L. Bogaerts, L. Carbonell, K. De Munck, B. Eyckens, S. Stoukatch, D.S. Tezcan, Z. Tokei, J. Vaes, 3D integration by Cu–Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias, in 2006 International Electron Devices Meeting (IEEE, 2006), pp. 1–4
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A 3D Implementation of Convolutional Neural Network for Fast Inference;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21
2. Galvanic displacement deposition of Ag using citric acid for Cu-to-Cu hybrid bonding;2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM);2023-05
3. Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices;Advanced Materials Technologies;2023-04-12