Materials and Processing of TSV-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Materials and Processing of TSV

Published:2020-11-24 Issue: Volume: Page:47-70
ISSN:1437-0387
Container-title:3D Microelectronic Packaging
language:
Short-container-title:

Author:

Kumar Praveen,Dutta Indranath,Huang Zhiheng,Conway Paul

Publisher

Springer Singapore

Link

http://link.springer.com/content/pdf/10.1007/978-981-15-7090-2_3

Reference61 articles.

1. E. Beyne, Through-silicon via technology for 3D IC, in Ultra-Thin Chip Technology and Applications, ed. by J.N. Burghartz (Springer, New York, 2011)

2. M. Stucchi, G. Katti, D. Velenis, TSV characterization and modeling, in Three Dimensional System Integration: IC Stacking Process and Design, ed. by A. Papanikolaou, D. Soudris, R. Radojcic (Springer, New York, 2011)

3. P.S. Andry, C.K. Tsang, B.C. Webb, E.J. Sprogis, S.L. Wright, B. Dang, D.G. Manzer, Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52, 571–581 (2008)

4. Z. Xu, J.Q. Lu, High-speed design and broadband modeling of through-strata-vias (TSVs) in 3D integration. IEEE Trans. Compon. Pack. Manuf. Technol. 1, 154–162 (2011)

5. J.Q. Lu, Advances in materials and processes for 3D-TSV integration. ECS Trans. 45, 119–129 (2012)

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermodynamic Simulation Analysis of TSV under Temperature Cycle;2022 IEEE Asia-Pacific Conference on Image Processing, Electronics and Computers (IPEC);2022-04-14

2. Geometric advection and its application in the emulation of high aspect ratio structures;Computer Methods in Applied Mechanics and Engineering;2021-12

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3