(Invited) Advances in Materials and Processes for 3D-TSV Integration

Abstract

There are a number of materials considered for various processes in 3D integration. These materials are critical to the development of key processes, such as through-strata-via (TSV), wafer and chip bonding, and wafer handling. This paper reviews the recent advances of some variable materials and processes, compares their advantages and technical challenges, and discusses the options towards full 3D-TSV integration.