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1. At the Locus of Performance: Quantifying the Effects of Copious 3D-Stacked Cache on HPC Workloads;ACM Transactions on Architecture and Code Optimization;2023-12-14
2. Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. TACC;Proceedings of the 15th ACM International Conference on Systems and Storage;2022-06-06