1. State of the Art of Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
2. At the Locus of Performance: Quantifying the Effects of Copious 3D-Stacked Cache on HPC Workloads;ACM Transactions on Architecture and Code Optimization;2023-12-14
3. Pick and Place of Sensitive Chips with Vacuum-Free Gecomer® Tools;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
4. Demonstration of a Wafer-level Integration for System-on-Wafer Architecture;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
5. Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05