An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor-Reference-Cited by-同舟云学术

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An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor

Published:2018-03 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)
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Author:

Kagawa Y.,Fujii N.,Aoyagi K.,Kobayashi Y.,Nishi S.,Todaka N.,Takeshita S.,Taura J.,Takahashi H.,Nishimura Y.,Tatani K.,Kawamura M.,Nakayama H.,Ohno K.,Iwamoto H.,Kadomura S.,Hirayama T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8408585/8421409/08421453.pdf?arnumber=8421453

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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