Semiconductor fault detection and classification for yield enhancement and manufacturing intelligence-Reference-Cited by-同舟云学术

Semiconductor fault detection and classification for yield enhancement and manufacturing intelligence

Published:2012-08-29 Issue:3 Volume:25 Page:367-388
ISSN:1936-6582
Container-title:Flexible Services and Manufacturing Journal
language:en
Short-container-title:Flex Serv Manuf J

Author:

Chien Chen-Fu,Hsu Chia-Yu,Chen Pei-Nong

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research

Link

http://link.springer.com/content/pdf/10.1007/s10696-012-9161-4.pdf

Reference27 articles.

1. Chen L-F, Chien C-F (2011) Manufacturing intelligence for class prediction and rule generation to support human capital decisions for high-tech industries. Flex Serv Manuf J 23(3):263–289

2. Chien C-F, Hsu C (2011) UNISON analysis to model and reduce step-and-scan overlay errors for semiconductor manufacturing. J Intell Manuf 22(3):399–412

3. Chien C-F, Wang W, Cheng J (2007) Data mining for yield enhancement in semiconductor manufacturing and an empirical study. Expert Syst Appl 33(1):192–198

4. Chien C-F, Chen Y-J, Peng J-T (2010) Manufacturing intelligence for semiconductor demand forecast based on technology diffusion and production life cycle. Int J Prod Econ 128(2):496–509

5. Chien C-F, Hsu C, Hsiao C (2011) Manufacturing intelligence to forecast and reduce semiconductor cycle time. J Intell Manuf. doi: 10.1007/s10845-011-0572-y

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