Author:
Gan C. L.,Classe F. C.,Chan B. L.,Hashim U.
Publisher
Springer Science and Business Media LLC
Subject
Inorganic Chemistry,General Materials Science
Reference35 articles.
1. Harman GG (1999) Wirebonding in microelectronic: materials, processes, reliability and yield, 2nd edn. McGraw Hill, New York
2. Chauhan P, Zhong ZW, Pecht M (2014) Copper wire bonding, 1st edn. Springer, New York
3. Chauhan P, Zhong ZW, Pecht M (2013) Copper wire bonding concerns and best practices. J Electron Mater. doi: 10.1007/s11664-013-2576-1
4. Schneider-Ramelow M, Geißler U, Schmitz S et al (2013) Development and status of Cu ball/wedge bonding in 2012. J Electron Mater 42:558–595. doi: 10.1007/s11664-012-2383-0
5. Appelt BK, Tseng A, Chen C-H, Lai Y-S (2011) Fine pitch copper wire bonding in high volume production. Microelectron Reliab 51:13–20
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献