Microstructure, wetting property of Sn–Ag–Cu–Bi–xCe solder and IMC growth at solder/Cu interface during thermal cycling
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s12598-015-0526-1.pdf
Reference19 articles.
1. Dudek MA, Sidhu RS, Chawla N. Novel rare-earth-containing lead-free solders with enhanced ductility. JOM. 2006;58(6):57.
2. Sona M, Prabhu KN. Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints. J Mater Sci Mater El. 2013;24(9):3149.
3. Anderson IE. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications. J Mater Sci Mater El. 2007;18(1–3):55.
4. Li DZ, Liu CQ, Conway PP. Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects. Mater Sci Eng, A. 2005;391(1–2):95.
5. Yoon JW, Kim SW, Jung SB. IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate. J Alloys Compd. 2005;392(1–2):247.
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