Author:
Dudek M. A.,Sidhu R. S.,Chawla N.
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Reference39 articles.
1. J. Bath, C. Handwerker, and E. Bradley, Circ Assemb. 11 (5) (2000), pp. 30–40.
2. I.E. Anderson et al., J. Electron Mater., 30 (2001), pp. 1050–1059.
3. D.H. Kim, P. Elenius, and S. Barrett, IEEE Trans. Electron. Pack. Manu., 25 (2) (2002), pp. 84–90.
4. M.E. Loomans and M.E. Fine, Metall. Mater. Trans. A, 31 (4) (2000), pp. 1155–1162.
5. A. Schubert et al., Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Piscataway, NJ: IEEE, 2001), pp. 129–134.
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