Author:
Qu Jun-Feng,Xu Jun,Hu Qiang,Zhang Fu-Wen,Zhang Shao-Ming
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Reference17 articles.
1. Yao P, Liu P, Liu J. Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150 °C. Microelectron Eng. 2009;86(10):1969.
2. Kanlayasiri K, Ariga T. Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–x In lead-free solders. J Alloys Compd. 2010;504(1):L5.
3. Lee TY, Choi WJ, Tu KN, Jang JW, Kuo SM, Lin JK, Frear DR, Zeng K, Kivilahti JK. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J Mater Res. 2002;17(2):291.
4. Frear DR, Jang JW, Lin JK, Zhang C. Pb-free solders for flip-chip interconnects. JOM. 2001;53(6):28.
5. Song JJ, Guo DY, Cai L, Mao Y. Solidification microstructure with fine full lamellar structure of Au–Sn eutectic alloy. Chin J Rare Met. 2013;37(1):44.
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