Author:
Fan Yeming,Guo Hong,Xu Jun,Chu Ke,Zhu Xuexin,Jia Chengchang,Yin Fazhang,Zhang Ximin
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Reference13 articles.
1. Kim L., Choi J.H., Jang S.H., and Shin M.W., Thermal analysis of LED array system with heat pipe, Thermochim. Acta, 2007, 455(1–2): 21.
2. Haque S., Steigerwald D., Rudaz S., Steward B., Bhat J., Collins D., et al., Packaging challenges of high-power LEDs for solid state lighting, [in] Proceedings of the 36th International Microelectronics and Packaging Society (IMAPS) Conference, Boston, 2003: 881.
3. Zweben C., Advanced materials for optoelectronic packaging, Semicond. Int., 2002, 25(10): S5.
4. Chu K., Jia C.C., Liang X.B., Liang X.B., Chen H., and Guo H., The thermal conductivity of pressure infiltrated SiCp/Al composites with various size distributions: experimental study and modeling, Mater. Des., 2009, 30: 3497.
5. Molina J.M., Narciso J., Weber L., Mortensen A., and Louis E., Thermal conductivity of Al-SiC composites with monomodal and bimodal particle size distribution, Mater. Sci. Eng A., 2008, 480(1–2): 483.
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献