Funder
National Natural Science Foundation of China
National Key Research and Development Program of China
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Development in electronic packaging–moving to 3D system configuration;Szendiuch;Radioengineering,2011
2. 3D Integration Technologies–An Overview, Materials for Advanced Packaging, Springer;Chanchani,2009
3. Microstructure and properties of Al/Si/SiC composites for electronic packaging;Zhu;Trans. Nonferrous Metals Soc. China,2012
4. On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites;Weber;Scripta Mater.,2007
5. Pressure infiltrated Cu/diamond composites for LED applications;Fan;Rare Met.,2011
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献