Study on radar electronic module cooling by using diamond/copper composites-Reference-Cited by-同舟云学术

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Study on radar electronic module cooling by using diamond/copper composites

Published:2023-12-02 Issue:1 Volume:3 Page:
ISSN:2694-1112
Container-title:Functional Diamond
language:en
Short-container-title:Functional Diamond

Author:

Li Jinwang¹²,Cong Tianshu¹,Dai Shugang¹³

Affiliation:

1. College of Astronautics, Nanjing University of Aeronautics and Astronautics, Nanjing, China

2. Jiangsu Province Key Laboratory of Aerospace Power System, Nanjing, China

3. Instituter 724 of China Shipbuilding Industry Corporation, Nanjing, Jiangsu, China

Funder

National Natural Science Foundation of China

Jiangsu Province Key Laboratory of Aerospace Power System

Publisher

Informa UK Limited

Subject

General Medicine

Link

https://www.tandfonline.com/doi/pdf/10.1080/26941112.2023.2273320

Reference21 articles.

1. Macroporous diamond foam: A novel design of 3D interconnected heat conduction network for thermal management

2. Application of high-thermal-conductivity diamond for space phased array antenna

3. Recent progress on interface and thermal conduction models of diamond/copper composites used as electronic packaging material[J];Deng J;Mater Reports,2016

4. Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

5. Corrosion performance and tribological behavior of diamond-like carbon based coating applied on Ni−Al−bronze alloy

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