Embedded passive components in advanced 3D chips and micro/nano electronic systems

Author:

Khan Muhammad Imran,Dong Huang,Shabbir Faisal,Shoukat Rizwan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference43 articles.

1. Xie J, et al. (2012) Enabling the 2.5D integration. In: Proceeding IMAPS Int Symp Microelectron, San Diego, pp 254–267

2. Banijamali B, et al. (2013) Reliability evaluation of a CoWoS-enabled 3D IC package. In: Proceeding 63rd IEEE/ECTC, pp 35–40

3. Lin L et al (2013) Reliability characterization of chip-on-wafer-on-substrate (CoWoS) 3D IC integration technology. In: Proceeding 63rd IEEE/ECTC, Las Vegas, pp 366–371

4. Andresakis J (2005) Embedded capacitors. Oak-Mitsui Technologies, New York

5. Banijamali B, Ramalingam S, Nagarajan K, Chaware R (2011) Advanced reliability study of TSV interposers and interconnects for the 28 nm technology FPGA. In: Proceeding 61st IEEE/ECTC, Orlando, pp 285–290

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