Co-deposition of C and Ni P to fabricate high-ohmic resistor for board-level integration with on-line monitoring method-Reference-Cited by-同舟云学术

Co-deposition of C and Ni P to fabricate high-ohmic resistor for board-level integration with on-line monitoring method

Published:2023-03 Issue: Volume:142 Page:114906
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhou Guoyun,Luo Yuxing,Hong Yan,He Wei,Wang Shouxu,Chen Yuanming,Wang Chong,Tang Yao,Sun Yukai,Zhu Yongkang,Li Jiujuan

Funder

Sichuan Province Science and Technology Support Program

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Electroless plating alloy thin-film embedded resistor materials;Su,2015

2. Drop-shock reliability improvement of embedded chip resistor packages through via structure modification;Park;Microelectron. Reliab.,2016

3. Embedded passive components in advanced 3D chips and micro/nano electronic systems;Khan;Microsyst. Technol.,2018

4. Traceability of printed circuit board assemblies using embedded electronic components;Janeczek;IET Microwaves Antennas Propag,2020

5. Embedded components in printed circuit boards: a processing technology review;Jillek;Int. J. Adv. Manuf. Technol.,2005

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