Drop-shock reliability improvement of embedded chip resistor packages through via structure modification-Reference-Cited by-同舟云学术

Drop-shock reliability improvement of embedded chip resistor packages through via structure modification

Published:2016-08 Issue: Volume:63 Page:194-200
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Park Se-Hoon,Park Jong Chul,Park Jae-Yong,Kim Young-Ho

Funder

Development of 300mm Multi-layered Composite Packaging Process and Equipment

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference28 articles.

1. Embedded Active Packaging Technology for High-Pin-Count LSI with Cu Plate;Mori,2011

2. Strategies for Embedding of Active Components;Ostmann,2006

3. A Novel IMB Technology for Integrating Active and Passive Components;Tuomminen,2000

4. Electrical Performance of Bumpless Build-up Layer Packaging;Braunisch,2002

5. Embedding Active Components inside Printed Circuit Board (PCB) — a Solution for Miniaturization of Electronics;Palm,2005

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